AGFB006R24D2I3V
AGFB006R24D2I3V
Part number:
544-AGFB006R24D2I3V-ND
Product_Category
System On Chip (SoC)
Manufacturer
Intel
Type
IC
Encapsulation
Package
Tray
RoHS:
YES
Quantity
500
$6,323.0400
Minimun: 1
multiples: 1
Quantity
Price
Total
3
$6,323.0400
$18,969.1200
AGFB006R24D2I3V NEWS
Specifications
TYPEDESCRIPTION
MfrIntel
SeriesAgilex F
PackageTray
Product StatusACTIVE
Package / Case2340-BFBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Number of I/O576
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 573K Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package2340-BGA (45x42)
ArchitectureMPU, FPGA
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